The change in gauge length of a specimen, in the direction of an
applied stress, divided by its original gauge length.
Strain gauge
An element (wire or foil) that measures a strain based on
electrical resistance changes of the gauge that result from a
change in length or dimension strain of the wire or foil.
Stress concentration
The concentration or amplification of an applied stress at the tip
of a notch or small crack.
Stress corrosion (cracking)
A form of failure resulting from the combined action of a tensile
stress and a corrosion environment, occurring at lower stress
levels than required when the corrosion environment is absent.
Superconductivity
A phenomenon characterized by the disappearance of the electrical
resistivity at temperatures approaching 0 K.
Surface Plasmon
A collective motion of electrons in the surface of a metal
conductor, excited by the impact of light of appropriate
wavelength at a particular angle.
Systematic error
An error that always occurs in the same direction.
TAB bonding
Tape automated bonding; semiconductor packaging technique that
uses a tiny lead-frame to connect circuitry on the surface of the
chip to a substrate instead of wire bonds.
Tensile strength (TS)
The maximum engineering stress, in tension, sustainable without
fracture; also called"ultimate (tensile) strength".
Tesla [T]
Unit of magnetic induction: 1T = 1 weber/m2 (also, 1T =
104 gauss).
