Manufactures end-effectors, wafer chucks and other wafer handling equipment
specifically suited for handling MEMS wafers. Our unique patented
technologies, originally developed for NASA, enable us to handle perforated,
warped, thin and even broken wafers with a higher level of safety and
significantly less backside contamination than any other supplier today. We
can also provide Zero-Contact wafer handling for even lower backside
contamination levels.
