Icemos Technology Ltd is a leading supplier of high
quality thick film bonded SOI (Silicon On Insulator)
wafers (Bonded SOI Wafers, Si-Si Bonded Wafers, and
SOI+Trench and Refill). Our expertise is on trench
etch and refill technology, with the ability to offer
trench etch and refill services to customers on bulk
Si substrates or on SOI. By combining both our SOI and
trench etch and refill technology, we provide
customers a unique dielectrically isolated substrate
preparation service.
