Provides MEMS foundry services for large and small volumes (6" and 4" wafer processing). Applied technologies are bulk- and surface micromachining including Si deep trench etching (DRIE, Bosch Process), wafer bonding (anodic and fusion), PECVD and LPCVD thin film depositions (undoped poly Si, boron-doped poly Si, Si3N4, low-stress Si nitride, TEOS, LTO), sputtering of metals and electroplating.
