Offers design, development and volume manufacturing of MEMS components
primarily for customers in the telecommunication and life science
markets. Specialties include bulk micromachining with etching,
V-groove and DRIE, anodic, fusion, adhesive and solder bonding,
surface micromachining with multilayer polysilicon, polyimide/BCB
dielectrics for RF applications, and electroplating and electroless
bumping of gold, nickel and solder tin. Components are developed and
fabricated in state-of-the-art class 10-10000 cleanrooms using 4", 6"
and 8" diameter wafers.
