Material: Copper (Cu), bulk

To purchase MEMS-related materials, supplies, equipment, wafers, etc.,please visit the links section of the MEMSNet site.

Property↑↓	Value↑↓	Conditions↑↓	Reference↑↓
Poisson's Ratio	0.36	Vias,used in a cell composed of a square copper via in a thin polyimide film mounted on top of a silicon substrate,properties are taken same as bulk properties.	Mechanics of Materials 23(1996), p.314
Specific heat	384.56 J/kg/K	At Temp=25 C.	CRC Materials Science and Engineering Handbook, p.260
Thermal conductivity	398 W/m/K	Value at temp=300 K.	CRC Materials Science and Engineering Handbook, p.270-274
Yield strength	100 MPa	Vias,used in a cell composed of a square copper via in a thin polyimide film mounted on top of a silicon substrate,properties are taken same as bulk properties.	Mechanics of Materials 23(1996), p.314
Young's Modulus	128 GPa	Vias,used in a cell composed of a square copper via in a thin polyimide film mounted on top of a silicon substrate,properties are taken same as bulk properties.	Mechanics of Materials 23(1996), p.314
density	8960 kg/m^3	25 degrees C	Handbook of the elements, S. Ruben, 2 nd printing (1987), Open Court Publishing