Used as a mover,min voltage to move the mover=850 V, bottom of the mover is glass plate,film condition:0.0416 um & deposited by Sol-gel method on silicon wafer.
IEEE Micro Electro Mechanical Systems Workshop,Jan-Feb 1991, Nara,Japan, p.151
Coefficient of static friction
0.16
Used as a mover,min voltage to remove the mover=1025 V,bottom of the mover is Silicon substrate,film condition:0.0416 um & deposited by Sol-gel method on silicon wafer.
IEEE Micro Electro Mechanical Systems Workshop,Jan-Feb 1991, Nara,Japan, p.151
Poisson's Ratio
0.27
Material property used in the finite element computations of ultra microhardness indentation of thin films,both coating and substrate are assumed to be homogenous and elastic/plastic.
Thin solid films 290-291(1996), p.363
Static frictional force(max)
0.000294 N
Used as a mover,min voltage to move the mover=850 V, bottom of the mover is glass plate,film condition:0.0416 um & deposited by Sol-gel method on silicon wafer.
IEEE Micro Electro Mechanical Systems Workshop,Jan-Feb 1991, Nara,Japan, p.151
Static frictional force(max)
0.000427 N
Used as a mover,min voltage to remove the mover=1025 V,bottom of the mover is Silicon substrate,film condition:0.0416 um & deposited by Sol-gel method on silicon wafer.
IEEE Micro Electro Mechanical Systems Workshop,Jan-Feb 1991, Nara,Japan, p.151
Young's Modulus
47.99 GPa
Ceramic,plasma sprayed,at room temperature
CRC Materials Science and Engineering Handbook, p.511
Young's Modulus
12 .. 100 GPa
Plasma sprayed,obtained from laser induced ultrasonic surface wave method for a thickness of 21-105 um, choosing an intermediate density.
Thin Solid Films 290-291(1996), p.309
Young's Modulus
160 GPa
Material property used in the finite element computations of ultra microhardness indentation of thin films,both coating and substrate are assumed to be homogeneous and elastic/plastic.