Dear all, I am trying to do electroplating of gold on silicon substrate
covered with thin layer of gold and photoresist on top of it.The
Photoresist is opened in some areas and i want to deposit gold in those
areas. But after going for some electrodepostion all i could observe that
the plated areas are reddish brown in colour instead of golden yellow
colour and the plating is not following the proper pattern and the
photoresist is appeared to be disturbed and lifted off and i could observe
cracks in the photoresist. Please suggest me regarding this problem.
Thankskris

I suggest reducing the current density of the gold plating, what rate in
microns/min are you plating?? what type of bath, CN or Sulfite??  You may
need an adhesion promoter between the resist and gold, or a different
phororesist all together, cracking of resists in gold is quite common,
newly developed resists by Shipley and others have improved the adhesion
and cracking phenom considerably.. feel free to call me to discuss ...Bob

Bob Forman
Shipley EIF Semiconductor  Advanced Packaging
425/785-9817
[email protected]