Hi Danny,

We have used surfactants before in wafer saw process. It helps reduce the
surface tension between silicon and DI water. The results effective saw dust
removal while dicing. Are you referring to wafer saw process / saw dust
issues. You can contact Keteka or Dynacraft for the surfactant solutions.
Regards Gautham Vish


----- Original Message -----
From: "Danny Klein" 
To: 
Sent: Thursday, April 24, 2003 8:11 PM
Subject: [mems-talk] Contact angle between water and silicon or silica


> Dear Members,
>
> Does anyone know the contact angle between water and silicon or silica?
Can anyone recommend a good website where this data could be found ?
> Has anyone ever dealt with interactions between surfactants solutions and
silicon or silica?
>
> Thank you in advance,
>
> Danny Klein
> -----------------------------------------------------
>
> Danny Klein
> Faculty of Mechanical Engineering
> Technion, Israel Institute of Technology
> Haifa, 32000
> Israel
>
> Tel (Lab.): 972-4-8292946(3861)
> Email: [email protected]
>
> -----------------------------------------------------
>
> _______________________________________________
> [email protected] mailing list: to unsubscribe or change your list
> options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
> Hosted by the MEMS Exchange, providers of MEMS processing services.
> Visit us at http://www.memsnet.org/