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MEMSnet Home: MEMS-Talk: Contact angle between water and silicon or silica
Contact angle between water and silicon or silica
2003-04-24
Danny Klein
2003-04-25
Gautham V
2003-04-24
Bill Moffat
2003-04-24
Phillipe Tabada
tooling for HF release etch
2003-04-29
Robert Dean
2003-04-29
Mighty Platypus
2003-04-29
Kirt & Erika Zipf-Williams
Contact angle between water and silicon or silica
Phillipe Tabada
2003-04-24
Hi Danny,

   From my experience, the water contact angle (WCA) on silicon is between
15-80 degrees depending on what process the wafer just went through (Out of
the box, HF, etc).  The WCA on silica (SiO2) would be less than 5 degree
depending on the quality of the oxide layer.  The addition of a non-ionic
surfactant like Triton X100 would cause the the WCA on silicon to decrease
while it could cause the WCA on silica to increase due to additional surface
contamination.

Phil Tabada






>From: "Danny Klein" 
>Reply-To: General MEMS discussion 
>To: 
>Subject: [mems-talk] Contact angle between water and silicon or silica
>Date: Thu, 24 Apr 2003 14:11:56 +0200
>
>Dear Members,
>
>Does anyone know the contact angle between water and silicon or silica? Can
>anyone recommend a good website where this data could be found ?
>Has anyone ever dealt with interactions between surfactants solutions and
>silicon or silica?
>
>Thank you in advance,
>
>Danny Klein
>-----------------------------------------------------
>
>Danny Klein
>Faculty of Mechanical Engineering
>Technion, Israel Institute of Technology
>Haifa, 32000
>Israel
>
>Tel (Lab.): 972-4-8292946(3861)
>Email: [email protected]
>
>-----------------------------------------------------
>
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