Dear All -
A colleague is using photoresist and a hydrogen peroxide wet etch to
pattern 200 nm thick W films. He is having adhesion problems for
etches longer than 30 seconds (large areas of PR peel off). He has
tried HMDS prime, 120 C post bake, etc. The post bake helped a
little, but he needs a more durable coat.
Does anyone have any lore for increasing PR adhesion to W in a
hydrogen eroxide etch?
Thanks,
Jim
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- Jim Beall 303-497-5989
[email protected]
