Check out the Twente group at:
http://www.el.utwente.nl/tt/projects/droog/
Some useful references are:
H.V. Jansen, M.J. de Boer, M.C. Elwenspoek
The black silicon method V: a study of the fabrication of movable
structures for micromechanical systems. Proc. Eigth Int. Conf. Solid
State Sens. Act. Transducers '95 and Eurosensors IX, (1995),
pp565-568.
H.V. Jansen, M.J. de Boer, M.C. Elwenspoek
The black silicon method IV: The fabrication of three dimensional
structures in silicon with high aspect ratios for scanning probe
microscopy and other applications. Proc. IEEE Micro Elec. Mech. Sys.
1995, A'dam, Netherlands, (1995), pp88-93.
H.V. Jansen, M.J. de Boer, J. Burger, R. Legtenberg, M.C. Elwenspoek
The black silicon method II: The effect of mask material and loading
on the reactive ion etching of deep silicon trenches. Microelec.
Engineering 27, (1995), pp475-480.
H.V. Jansen, M.J. de Boer, R. Legtenberg, M.C. Elwenspoek
The black silicon method: a universal method for determining the
parameter setting of a fluorine based reactive ion etcher in deep
silicon trench etching with profile control. Journal of Micomech.
Microeng. 5 (1995), pp. 115-120.
>Dear members,
>
> Does anyone have background information of how black silicon can
>be formed in RIE system? In my case, see black silicon on silicon wafer
>after long (more than 10mins) CF4/H2 plasma exposure. The surface is also
>powdery with this black stuff. If you know anything about it or any good
>reference paper, would you please let me know? Thanks a lot.
>
>
>Yours sincerely,
>
>Isaac Chan
>
>Ph.D. Candidate
>Dept. Electrical & Computer Engineering
>University of Waterloo
>200 University Ave. W
>Waterloo, Ontario, Canada
>N2L 3G1
>Tel: (519) 729-6409, ext. 6014
>Fax: (519) 746-6321
>[email protected]
>http://www.ece.uwaterloo.ca/~a-sidic
>
>
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