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MEMSnet Home: MEMS-Talk: bonding and debonding
bonding and debonding
2003-05-15
Rahul Agarwal
2003-05-16
David Nemeth
Aluminium etching
2003-05-19
Seh-Won Ahn
2003-05-19
R. Brent Garber (2 parts)
2003-05-29
Wimplinger Markus
bonding and debonding
Wimplinger Markus
2003-05-29
Hello Rahul,

There are several possibilities to approach your problem:

* Wax (solid at Room Temperature) can be spun on with a heated dispense system
and a heated spinner chuck.
* Some Waxes are available /can be dissolved in a solvent and then can be spun
on at Room Temperature like Photo Resist.
During the curing of the wax, the solvent evaporates and the coating acts like a
usual wax.

* There are some dry laminated adhesive tapes available, which debond when
heated. (Revalpha from Nitto Denko or Rexpan from Haeun Chemtec) This process is
however not reversible. - Means that you just can bond and debond once with the
same tape.

EVG produces equipment for all these process schemes that automates the whole
process including wax coating, bonding, debonding and cleaning in a cassette to
cassette manner.
For further information, please check out our web site at www.evgroup.com

Best regards,
Markus Wimplinger

Technology Manager EVG US, Phoenix AZ, [email protected]

-----Original Message-----
From: Rahul Agarwal [mailto:[email protected]]
Sent: Donnerstag, 15. Mai 2003 11:54
To: [email protected]
Subject: [mems-talk] bonding and debonding


Hello Everyone,
I am looking for a spin on material which can be used for bonding and debonding
and then again bonding like wax.  For example Silicon can be bonded using wax,
and can be easily unbonded by heating. This procedure is repeatable. Since I
can't put wax in a very very uniform matter I want some thing which is spin on.
Photoresist won't work since it can't be melted once baked. It can only be
removed but i want something which can be melted again and again.
Rahul Agarwal
Research Assistant
Univ. of south florida, Tampa
fl-33613
Ph. 813-974-3945From [email protected] Fri May 16 06:37:07 2003
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.Hello Bobo,
try pad etch, it works well. There are mixtures with BOE / ethylenglycol/ =
water (my mixture contents 210 ml ethylenglycol, 370 ml BOE 7:1 and 430 ml=
 water).There are also mixtures with acetic acid. Ask your supplier for ch=
emicals, if they have pad etch.
good luck
Anke

> -----Original Message-----
> From: [email protected] [mailto:[email protected]=
g]On
> Behalf Of bobo
> Sent: Thursday, May 15, 2003 6:31 AM
> To: [email protected]
> Subject: [mems-talk] Etching SiO2 without affecting Aluminum
>=20
>=20
> Dear all,
> does anyone knows what wet etchant can etching silicon dioxide without
> etching aluminum at the same time=3F   Thanks.
> =5F=5F=5F=5F=5F=5F=5F=5F=5F=5F=5F=5F=5F=5F=5F=5F=5F=5F=5F=5F=5F=5F=5F=5F=5F=5F
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> End of MEMS-talk Digest, Vol 7, Issue 19
> ****************************************


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