Hi,everybody

Now I will etch Si 350um on the backside of the wafer by STS ICP.After the
etching,the wafer becomes very fragile. So I need to use a carrier wafer to
support the fragile wafer in STS ICP etching.How to adhere the fragile wafer to
the carrier wafer is a big problem.Because I will use the frontside of the wafer
in optical application,I do not want to destroy the surface quality by the
adhension.Would you please give me some advice on this point? What material is
suitable for using as such an adhension layer?

Maybe we could use photoresist as the adhension layer.I heard that a lot of
people use this method.But I could not get a good etching results with comb
driver structure by this method.I think maybe the reason is that the photoresist
does not have a good thermal conductibility.Have you used photoresist as the
adhension layer in such an application?How do you improve the thermal
conductibility in this case?And could you tell me the detailed procedure on how
to adhere the fragile wafer to the carrier wafer by photoresist for ICP etching?

Thank you very much.

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