Hi,

I am wondering if anyone can suggest a polyimide for
my application. I want to coat a nickel substrate with
a polyimide film (preferably by spin coating). Then I
want to process pr on the polyimide, deposit metal and
do lift off, all the while keeping the polyimide layer
unchanged. The film should have:

1. Good adhesion to the substrate (nickel),
2. Should survive lift-off of thin positive pr
(acetone),
3. Should provide good adhesion to Cr-Au or TiW-Au
layer,
4. And it would be nice if the polyimide can withstand
a temperature of at least 175 C.

I have heard of photodefinable polymides by HD
microsystem, and the PI2610 series, but I think they
are used for patterning the polymide itself. I want to
use the polyimide as an underlying layer, so it should
not be attacked by UV light, pr developer and acetone.


I would appreicate any help,

Abhinav
CAMD, LSU

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