One method you might consider is planarization using energetic ion
deposition. There is a company just down the street from you in Hoboken
that could provide either a coating service or upgrade to an existing
machine. The contact is Plasmion Corp, 201-963-5450, www.plasmion.com

-Mike

>>> [email protected] 06/10/03 08:56PM >>>
Hi all,

I have a question which bothering me for a long time. I use SOI wafer
for my porject. After DRIE, the device layer was etched down to the
buried oxide layer. Now I need to fill these 6um wide, 20um deep
trenches with metal. But I could not find a way that guarantee uniform
and nice result. Does anyone has similar experience or good suggestions?
Thank you for your time.

Wuyong Peng
NJIT
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