I'm looking for a spin-on non-UV curable material that I would be able to spin-
on at 40 microns thick would be resistant to Acetone, IPA, Gold etch (KI, I2),
Cr etch (CEP200), and temperature up to 200 C.

Currently, We are mounting dies onto another wafer with 42 microns of SU-8 which
forces us to use transparent wafers and also some unnessecary steps. We would
like to improve this process by spinning on something comparable that only
requires some heat.  Any suggestion would greatly be appreciated.

Thanks,

Greg Miller
KVH Industries
8412 W 185th Street
Tinley Park, IL 60477
Email: [email protected]