Dear Friends
    We are in the process of validating our film stress data. Can anybody
suggest us the typical stress range of the following films.


Dep. Method     Film Type       Thick.      Dep. Temp.
LPCVD           Polysilicon     20000 A     620 Deg. C
PECVD           Nitride         10000 A     400 Deg. C
LPCVD           Nitide          1500 A      770 Deg. C
LTO             PSG             8000 A      420 Deg. C
PECVD           Oxide           20000 A     400 Deg. C
DC sputtred     Aluminium       6000 A      220 Deg. C


Sincerely yours

   RAJKUMAR
SCL, India
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