hi.

I heard about Cu could be patterned by something like CMP Process ( damascene(?)
process)

Are there any wet etchants fot Cu etch? If not, what is the main reason about
that?

Furthermore, Adhesion layer (Ti or Cr) is not required when I deposit Cu on Si
Wafer ?

Thank you for in Advance.

TW Lee.

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AeroMEMS Laboratory.
School of Mechanical & Aerospace Engineering.
Seoul National University , Seoul , KOREA.