Damascene and dual damascene processes were developed
as there is NO DRY etching for copper. The damascene
process is oposite compare to the classical way of
depositing and patterning of metal. Damascene is done
by etching trenches, depositing a seed layer,
electroplating copper in the trenches and CMP the
surface to separate copper lines from each other.

Pavel
P.S.
Wet etching proces is not suitable for micrometer
lines and below.

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