Dear Thomas

Try a two-step pre- and post-exposure bake and a 10 min relaxation time between
pre-exposure bake and post-exposure bake. I would use this protocol:
pre-exposure bake: 5 min @ 60 C
                  20 min @ 95 C
relax 10 min at RT
...
post-exp bake:  1 min @ 60 C
               10 min @ 95 C

This is suggested in the following document and the two-step bake took care of
the wrinkles for me, albeit for thinner films (ca. 30 um)
http://www.microchem.com/products/pdf/SU8_2035-2100.pdf


Chris


In message <000c01c34093$b84a19a0$abe3fea9@thomas> General MEMS discussion
 writes:
> Dear collegues,
>
> I have some problems in doing MicroChem SU-8 2075 PR on Si. My process is:
> spin 500rpm and 3000rpm 30secs
> soft bake: 95C 15mins in oven
> UV explore with filter WB-360: 300secs
> PEB: 95C 10mins in oven
> Develop: about 10mins
>
> I found that the surface of SU-8 becomes wrinkling after PEB and my pattern
peer off after develop. Can anyone give me some suggestions? Thank you very
much.
>
> Thomas
>

--
Christopher F. Blanford
Inorganic Chemistry Laboratory, South Parks Road, Oxford, OX1 3QR, UK
Phone: (44)/(0)-1865-282603; Fax: (44)/(0)-1865-272690
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