Ferric Chloride in water will etch copper.  It's used to make printed
circuit boards.
I strongly suspect an adhesion layer would be necessary for copper on
silicon, but I have no direct experience.

David Nemeth
Senior Engineer
Sophia Wireless, Inc.
14225-C Sullyfield Circle
Chantilly, VA
-----Original Message-----
From: [email protected] [mailto:[email protected]]On
Behalf Of 이태원
Sent: Wednesday, July 02, 2003 11:01 AM
To: [email protected]
Subject: [mems-talk] Cu Metal Etchant


hi.

I heard about Cu could be patterned by something like CMP Process
 damascene(?) process)

Are there any wet etchants fot Cu etch? If not, what is the main reason
about that?

Furthermore, Adhesion layer (Ti or Cr) is not required when I deposit Cu on
Si Wafer ?

Thank you for in Advance.

TW Lee.

-----------------------------------------------------------
AeroMEMS Laboratory.
School of Mechanical & Aerospace Engineering.
Seoul National University , Seoul , KOREA.
_______________________________________________
[email protected] mailing list: to unsubscribe or change your list
options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
Hosted by the MEMS Exchange, providers of MEMS processing services.
Visit us at http://www.memsnet.org/