> Wafers have two polishing options: Double Side Polished or Single Side
> Polished. I am wondering whats the particular applications for these two
types
> of wafers? Why are they differentiated?
> Anybody could enlighten me?

If you need to do lithography or wafer bonding on the back side of the wafer
(as is required for many MEM devices),
DSP is needed.
    --Kirt Williams, Ph.D.    consultant