Hi Derek,
Either matel will make a fine adhesion layer. Of the Cr and Ti, Ti tends
to have a lower stress, but it is susceptible to HF.

Jesse Fowler
  UCLA/MAE Dept., 420 Westwood Plaza, Room 37-129, ENGR IV
  Los Angeles, CA 90095-1597 | (310)825-3977
"Observations of nature, no matter how seemingly arcane, are like
peeling off one more layer from the great onion of knowledge"
    -- Don Petit, ISS science officer

On Mon, 7 Jul 2003, Chen-Han Lee wrote:

> Hi everyone,
>
> thank you all especially Kirk and Bob,
> you mention a adhesive layer for sputter platinum on silicon wafer
> what material should i use? Will Ti or Cr do the job?
> One more question, can i sputter gold on silicon wafer?
>
> Derek
> 7/7/03
>
> ----- Original Message -----
> From: "Kirt & Erika Zipf-Williams" 
> To: "General MEMS discussion" 
> Sent: Thursday, July 03, 2003 7:25 PM
> Subject: Re: [mems-talk] platinum on SU-8
>
>
> > > Good day everyone,
> > > I am a research student in U.K.
> > > Could anyone please tell me wome ways i can deposite platinum film on
> > SU-8?
> > > Any suggestions are welcomed.
> > > Thank you for your time.
> > > Chen-Han Lee
> >
> > You can sputter or evaporate platinum.
> > Don't forget to use an adhesion layer.
> >
> >     --Kirt Williams, Ph.D.   consultant
> >
> >
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>
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