I've used 0.5um thick photoresist (spr 1813) hardbaked for 40 minute oxide
etch (4um thickness) using HF (7:1) . The resist was spun on oxide so its
possible that pyrex will not have any adhesion problem either.

Let me know if you try it out on pyrex and what results you get !!

thanks,
Sunil.

Optical Semiconductor & Devices
EEE, Imperial College
London UK SW7 2BT

Phone: 020 7594 6294
----- Original Message -----
From: "Tom Fan" 
To: 
Sent: Friday, July 18, 2003 9:39 AM
Subject: [mems-talk] Pyrex Etch


>
>
> I've dug through the MEMS-talk archives trying to find out some info on
wet
> etching of Pyrex. Most of the posts address to deep glass etching and most
> people use Cr/Au as etching masks. I want to do a shallow etch (4 um)
instead.
> Would photoresist be able to stand HF for such a shallow etch or Cr/Au
still
> need to be used? I also learned from the past discussion that photoresist
does
> not adhere well to Pyrex wafers. Is this true? This is the reason that Cr
is
> deposited before the photoresist, but what is the role of Au then?
>
> Thanks,
> Tom Fan
>
>
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