Hi All,

I've done some experiment about silicon to glass anodic bonding.
The bonding was performed at temperature 400 C and 600 V, however it's
followed by the increasing of the current, exceeding 10 mA and then I
found that my p-100 silicon and corning glass was cracked and broken,
but  the bonding is still occured. I use stainless plate and gold
needle probe to apply the voltage. The silicon wafer and
glass was cleaned using acetone cleaning.

Could someone help me explaining this ?
Every comment would be appreciated.

Best regards,

mamien