Dear Administrator,

Below is my question to mems-talk. please post it.

I am trying to deposit NiCr pattern to PDMS. PDMS is spun on the Si wafer.

At first, I tried to lift-off after pattern PR on PDMS, but PR has cracks when
baking due to thermal mismatch (my quess) between Si and PR. So, I changed to
the way that I deposit metal first then PR spinning and patterning, and NiCr
etching using  NiCr etchant.

However, when I deposit NiCr on PDMS by using sputtering, there are serious
cracks on metal. I don't know how I can solve this problem. I appreciate any
comments and expertises. Thanks.


Sincerely,

---------------------------------------------------------
Byunghoon Bae

Visiting scholar
Mechanical & Industrial Engineering
Univesity of Illinois at Urbana-Champaign
26 MEB MC-244
1206 W. Green St. Urbana, IL 61801
Tel: 1-217-244-7301, Fax: 1-217-244-6534
E-mail: [email protected]

Ph. D. candidate
Dept. of Mechatronics
Kwangju Inst. of Science and Technology(K-JIST)

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Member of mind(maum) meditation center

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