Dear All;

 I am trying to electroplate Nickel - Tungsten (Ni-W) alloy
for making high aspect ratio structure.

 I want to measure the deposition rate of this alloy.
 but it takes so much time. I think there will be some great
methods to measure the electroplating deposition rate.

 I am showing how I measure the deposition rate.

 1. Preparing the wafer with photoresist patterning
 2. Electroplating for 2 hours
 3. Stop electroplating and measure the deposition height with a profiler
 4. Calculate the deposition rate by dividing the deposition height with
time


Thanks. I will wait your advices.