Cr doesn't work? Al or Ta may also have the chance.

Hongjun Zeng, PhD
****************************************
Microfabrication Applications Laboratory (MAL)
University of Illinois at Chicago
ERF Building, 842 W. Taylor Street
Chicago, IL 60607-7022
Tel.: 312-413-5889, Fax: 312-996-6465
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-----Original Message-----
From: [email protected]
[mailto:[email protected]]On Behalf Of
Mark Leonard
Sent: Tuesday, August 05, 2003 8:23 AM
To: [email protected]
Subject: [mems-talk] Ag adhesion


Hi

We are having a few problems with a e-beam evaporated film of Ag, ~5-10
microns thick. We have tried putting a seed layer of Ti down onto glass and
Si but the Ag film just comes away from the Ti. Can anyone suggest a better
seedlayer onto glass or Si before we deposit the Ag

Many thanks

Mark Leonard
Electrical, Electronic and Computer Eng,
Mountbatten Building,
Heriot Watt University
Riccarton
Edinburgh EH14 4AS
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