Try adding saccharin at 3 g/l or you can puchase comercial stress
reducers (e.g. JB-100 from Techniques). Also, I think there is a minimum
in the stress as a function of pH. Seems like the minimum was around
4.25. You should check this, see Modern Electroplating - I dont remember
the author's name.

Good luck,
    Mike


>>> [email protected] 08/04/03 10:28PM >>>
Hi,

We got problems with internal stress by electroplating nickel-stamps up
to 3mm thickness. We use a nickelsulfamate-bath: Ni-sulfamate 450g/l
(Barett); Boracid - 30g/l; fluortenside 1g/l; 54°C; pH 3-4; 1,8A/dm2.
Our Ni-stamps (4X7cm) were bent very much (over 300µm of 7cm). we tried
to reduce the current density, but this haven't brought better results.

We need help....

Peter
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