I've had successfull sputtered Ag adhesion using ~250nm Cr on a
polyimide substrate. My silver layers were only 0.1 microns though. Such
a thick film may have some serious stress issues.

-Mike


>>> [email protected] 08/05/03 06:23AM >>>
Hi

We are having a few problems with a e-beam evaporated film of Ag, ~5-10
microns thick. We have tried putting a seed layer of Ti down onto glass
and Si but the Ag film just comes away from the Ti. Can anyone suggest a
better seedlayer onto glass or Si before we deposit the Ag

Many thanks

Mark Leonard
Electrical, Electronic and Computer Eng,
Mountbatten Building,
Heriot Watt University
Riccarton
Edinburgh EH14 4AS
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