Hi,

I wanted to get some feedback on potential infrared inspection/automated
optical inspection applications in Wafer Bonding and bond issues for
finished wafers. We currently have an automated infra red system for
inspection of seal quality/position for glass frit bonded MEMS wafers where
we inspect the whole wafer at the die level prior to dicing. The key here is
making sure the glass frit has bonded appropriately (to ensure hermeticity)
and has not "moved" too close to the device itself using optical inspection.




Are there similar needs with anodic, direct or polymer type bonding - in
other words is there a need for any automated inspection of the bond
interface at the device level?



What about general wafer level bonding inspection needs for SOI wafers etc.?




Any opinions welcome!



________________________________________________

Tom Molamphy

Phoseon Technology

Office: 970 266 8097

Cell: 970 443 1864

Fax: 970 267 0801

www.phoseon.com