Hi All,

Any idea on where I might find market data for use of different wafer
bonding methods for MEMS? Any opinions on likely winners in this technology
moving forward?

Thanks,

Tom

________________________________________________

Tom Molamphy

Phoseon Technology

Office: 970 266 8097

Cell: 970 443 1864

Fax: 970 267 0801

www.phoseon.com