Hi
  I need to fabricate RF MEMS based on cantilever beam
structure.Can anybody do it if I provide the designs of my own.If
so,please let me know the prices(charge in $),time etc....

sukanta

On Fri, 08 Aug 2003 [email protected] wrote :
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>Today's Topics:
>
>    1.         InfraRed Inspection/Automated Inspection opportunities
>in
>       MEMSWafer       Bonding (Tom Molamphy)
>    2. Market Size for different Wafer Bonding Methods? (Tom
>Molamphy)
>    3. RE: Re: Diffusion or Ion implantation (Karl Cazzini)
>    4. RE: Market Size for different Wafer Bonding Methods?
>       (Maurice Norcott)
>    5. RE: Glass-Glass bonding (Brubaker Chad)
>    6. Tanks for KOH etching (Mark West)
>    7. need thin film SOI wafers (Marcus Siegert)
>    8. RE: Tanks for KOH etching (beaton@npphotonics (Bill
>Eaton))
>    9. RE: Re: Diffusion or Ion implantation (Chris Kovach)
>
>
>----------------------------------------------------------------------
>
>Message: 1
>Date: Thu, 7 Aug 2003 09:43:16 -0600
> From: "Tom Molamphy" 
>Subject: [mems-talk]   InfraRed Inspection/Automated Inspection
>       opportunities in MEMSWafer      Bonding
>To: 
>Message-ID: <001501c35cfa$9f172760$e5aefea9@CPQ28582865189>
>Content-Type: text/plain;      charset="us-ascii"
>
>Hi,
>
>I wanted to get some feedback on potential infrared
>inspection/automated
>optical inspection applications in Wafer Bonding and bond issues
>for
>finished wafers. We currently have an automated infra red system
>for
>inspection of seal quality/position for glass frit bonded MEMS
>wafers where
>we inspect the whole wafer at the die level prior to dicing. The
>key here is
>making sure the glass frit has bonded appropriately (to ensure
>hermeticity)
>and has not "moved" too close to the device itself using optical
>inspection.
>
>
>
>
>Are there similar needs with anodic, direct or polymer type
>bonding - in
>other words is there a need for any automated inspection of the
>bond
>interface at the device level?
>
>
>
>What about general wafer level bonding inspection needs for SOI
>wafers etc.?
>
>
>
>
>Any opinions welcome!
>
>
>
>________________________________________________
>
>Tom Molamphy
>
>Phoseon Technology
>
>Office: 970 266 8097
>
>Cell: 970 443 1864
>
>Fax: 970 267 0801
>
>www.phoseon.com
>
>
>
>
>
>
>
>
>------------------------------
>
>Message: 2
>Date: Thu, 7 Aug 2003 09:45:41 -0600
> From: "Tom Molamphy" 
>Subject: [mems-talk] Market Size for different Wafer Bonding
>Methods?
>To: 
>Message-ID: <001a01c35cfa$f54ba2a0$e5aefea9@CPQ28582865189>
>Content-Type: text/plain;      charset="us-ascii"
>
>Hi All,
>
>Any idea on where I might find market data for use of different
>wafer
>bonding methods for MEMS? Any opinions on likely winners in this
>technology
>moving forward?
>
>Thanks,
>
>Tom
>
>________________________________________________
>
>Tom Molamphy
>
>Phoseon Technology
>
>Office: 970 266 8097
>
>Cell: 970 443 1864
>
>Fax: 970 267 0801
>
>www.phoseon.com
>
>
>
>
>
>
>
>
>------------------------------
>
>Message: 3
>Date: Thu, 7 Aug 2003 12:17:04 -0400
> From: "Karl Cazzini" 
>Subject: RE: [mems-talk] Re: Diffusion or Ion implantation
>To: ,       "General MEMS discussion"
>       
>Message-ID: 
>Content-Type: text/plain;      charset="iso-8859-1"
>
>probably the best people for this are implant Sciences
>Corporation in
>Wakefield MA.
>www.implantsciences.com
>
>Speak to Richard Sahagian.
>
>
>
>-----Original Message-----
> From: [email protected]
>[mailto:[email protected]]On
>Behalf Of
>[email protected]
>Sent: Wednesday, August 06, 2003 2:51 PM
>To: General MEMS discussion
>Subject: Re: [mems-talk] Re: Diffusion or Ion implantation
>
>
>you can try Virginia semiconductor
>
>anupama
>
> > Hi All:
> >
> > I am looking for a vendor for diffusion or Ion
> > implantation of 4"  silicon wafers.
> >
> > Thanks for any lead information.
> >
> > --
> > Tian
> >
> >
> > _______________________________________________
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>
>
>------------------------------
>
>Message: 4
>Date: Thu, 7 Aug 2003 09:47:33 -0700
> From: Maurice Norcott 
>Subject: RE: [mems-talk] Market Size for different Wafer
>Bonding
>       Methods?
>To: "'[email protected]'" ,
>'General
>       MEMS discussion' 
>Message-ID:
><[email protected]>
>Content-Type: text/plain;      charset="iso-8859-1"
>
>
>Contact Dr.Farrens @ EV Group, she can probably answer
>most if not all of your questions on IR inspection and
>bonding methods for MEMS.
>
>602-437-9492 or 602-432-9406 cell
>
>-----Original Message-----
> From: Tom Molamphy [mailto:[email protected]]
>Sent: Thursday, August 07, 2003 8:46 AM
>To: [email protected]
>Subject: [mems-talk] Market Size for different Wafer Bonding
>Methods?
>
>
>Hi All,
>
>Any idea on where I might find market data for use of different
>wafer
>bonding methods for MEMS? Any opinions on likely winners in this
>technology
>moving forward?
>
>Thanks,
>
>Tom
>
>________________________________________________
>
>Tom Molamphy
>
>Phoseon Technology
>
>Office: 970 266 8097
>
>Cell: 970 443 1864
>
>Fax: 970 267 0801
>
>www.phoseon.com
>
>
>
>
>
>
>
>_______________________________________________
>[email protected] mailing list: to unsubscribe or change your
>list
>options, visit
>http://mail.mems-exchange.org/mailman/listinfo/mems-talk
>Hosted by the MEMS Exchange, providers of MEMS processing
>services.
>Visit us at http://www.memsnet.org/
>
>
>
>------------------------------
>
>Message: 5
>Date: Thu, 7 Aug 2003 10:13:24 -0700
> From: "Brubaker Chad" 
>Subject: RE: [mems-talk] Glass-Glass bonding
>To: "General MEMS discussion" 
>Message-ID:
>       <[email protected]>
>Content-Type: text/plain;      charset="iso-8859-1"
>
>Dear All,
>
>A good reference for gold-gold thermocompression bonding is as
>follows:
>
>C.H. Tsau, M. A. Schmidt, S.M. Spearing, "Fabrication Process and
>Plasticity of Gold-Gold Thermocompression Bonds," 6th Symposium
>on Semiconductor Wafer Bonding: Science, Technology, and
>Applications, ECS Proceedings, 2001
>
>In general, gold is resistant to BOE (and many other
>chemistries), and so may serve as an etch mask.  However, gold
>adhesion is notoriously bad, so you will want to use Ti as an
>adhesion layer. Also, bear in mind that BOE is an isotropic etch
>process, and so there will definitely be some undercutting during
>the etch (especially if you are doing a deep etch).
>
>We do manufacture wafer level bonding equipment, and as such,
>have a large amount of experience in many forms of wafer bonding,
>such as the thermocompression process being discussed, and with
>direct bonding processes such as those mentioned below, as well
>as those using various surface activation methods. If you have
>any further questions or concerns, feel free to contact me, or to
>browse our website at www.evgroup.com.
>
>Best Regards,
>Chad Brubaker
>
>EV Group       invent * innovate * implement
>Technology - Tel: (602) 437-9492, Fax: (602)437-9435 e-mail:
>[email protected], www.EVGroup.com
>
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>
>  -----Original Message-----
> From:         Carsten Wesselkamp [mailto:[email protected]]
>Sent:  Thursday, August 07, 2003 7:20 AM
>To:    General MEMS discussion
>Subject:       RE: [mems-talk] Glass-Glass bonding
>
>Dear Ryan,
>
>it is possible to do a direct bonding of glass to glass without
>any
>intermediate layer. This process can be done at Plan Optik GmbH
>in Germany.
>
>If you are interested - please contact me directly.
>
>Best regards,
>
>Carsten Wesselkamp
>
>Plan Optik GmbH
>Germany
>http://www.planoptik.com
>
>Tel.: +49-2664-5068-25
>Fax: +49-2664-5068-91
>
>
>
>
>-----Original Message-----
> From: BRAD JOHNSON [mailto:[email protected]]
>Sent: Wednesday, August 06, 2003 6:29 PM
>To: [email protected]; [email protected]
>Subject: Re: [mems-talk] Glass-Glass bonding
>
>
>Ryan,
>We have great experience in this area.  I also have a trick that
>may work
>for you that will be much easer if your process will allow it.
>Please
>contact me direct.
>
>Brad Johnson
>Suss MicroTec

sukanta Debbarma
Scientific officer
SAMEER,IIT Mumbai-400076
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