Hi,
Maybe we can do some works on the fabrication of RF
MEMS for you.We have some applications bsaed on
cantilever beam. if you can describe the cantilever
beam structure in detail, and i will estimate the
prices, time etc.

Wang

 --- Sukanta  的正文：> Hi
>   I need to fabricate RF MEMS based on cantilever
> beam
> structure.Can anybody do it if I provide the designs
> of my own.If
> so,please let me know the prices(charge in $),time
> etc....
>
> sukanta
>
> On Fri, 08 Aug 2003 [email protected]
> wrote :
> >Send MEMS-talk mailing list submissions to
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> >
> >When replying, please edit your Subject line so it
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> >specific
> >than "Re: Contents of MEMS-talk digest..."
> >
> >
> >Today's Topics:
> >
> >    1.       InfraRed Inspection/Automated Inspection
> opportunities
> >in
> >       MEMSWafer     Bonding (Tom Molamphy)
> >    2. Market Size for different Wafer Bonding
> Methods? (Tom
> >Molamphy)
> >    3. RE: Re: Diffusion or Ion implantation (Karl
> Cazzini)
> >    4. RE: Market Size for different Wafer Bonding
> Methods?
> >       (Maurice Norcott)
> >    5. RE: Glass-Glass bonding (Brubaker Chad)
> >    6. Tanks for KOH etching (Mark West)
> >    7. need thin film SOI wafers (Marcus Siegert)
> >    8. RE: Tanks for KOH etching
> (beaton@npphotonics (Bill
> >Eaton))
> >    9. RE: Re: Diffusion or Ion implantation (Chris
> Kovach)
> >
> >
>
>----------------------------------------------------------------------
> >
> >Message: 1
> >Date: Thu, 7 Aug 2003 09:43:16 -0600
> > From: "Tom Molamphy" 
> >Subject: [mems-talk]         InfraRed Inspection/Automated
> Inspection
> >     opportunities in MEMSWafer      Bonding
> >To: 
> >Message-ID:
> <001501c35cfa$9f172760$e5aefea9@CPQ28582865189>
> >Content-Type: text/plain;    charset="us-ascii"
> >
> >Hi,
> >
> >I wanted to get some feedback on potential infrared
>
> >inspection/automated
> >optical inspection applications in Wafer Bonding
> and bond issues
> >for
> >finished wafers. We currently have an automated
> infra red system
> >for
> >inspection of seal quality/position for glass frit
> bonded MEMS
> >wafers where
> >we inspect the whole wafer at the die level prior
> to dicing. The
> >key here is
> >making sure the glass frit has bonded appropriately
> (to ensure
> >hermeticity)
> >and has not "moved" too close to the device itself
> using optical
> >inspection.
> >
> >
> >
> >
> >Are there similar needs with anodic, direct or
> polymer type
> >bonding - in
> >other words is there a need for any automated
> inspection of the
> >bond
> >interface at the device level?
> >
> >
> >
> >What about general wafer level bonding inspection
> needs for SOI
> >wafers etc.?
> >
> >
> >
> >
> >Any opinions welcome!
> >
> >
> >
> >________________________________________________
> >
> >Tom Molamphy
> >
> >Phoseon Technology
> >
> >Office: 970 266 8097
> >
> >Cell: 970 443 1864
> >
> >Fax: 970 267 0801
> >
> >www.phoseon.com
> >
> >
> >
> >
> >
> >
> >
> >
> >------------------------------
> >
> >Message: 2
> >Date: Thu, 7 Aug 2003 09:45:41 -0600
> > From: "Tom Molamphy" 
> >Subject: [mems-talk] Market Size for different
> Wafer Bonding
> >Methods?
> >To: 
> >Message-ID:
> <001a01c35cfa$f54ba2a0$e5aefea9@CPQ28582865189>
> >Content-Type: text/plain;    charset="us-ascii"
> >
> >Hi All,
> >
> >Any idea on where I might find market data for use
> of different
> >wafer
> >bonding methods for MEMS? Any opinions on likely
> winners in this
> >technology
> >moving forward?
> >
> >Thanks,
> >
> >Tom
> >
> >________________________________________________
> >
> >Tom Molamphy
> >
> >Phoseon Technology
> >
> >Office: 970 266 8097
> >
> >Cell: 970 443 1864
> >
> >Fax: 970 267 0801
> >
> >www.phoseon.com
> >
> >
> >
> >
> >
> >
> >
> >
> >------------------------------
> >
> >Message: 3
> >Date: Thu, 7 Aug 2003 12:17:04 -0400
> > From: "Karl Cazzini" 
> >Subject: RE: [mems-talk] Re: Diffusion or Ion
> implantation
> >To: ,     "General MEMS
> discussion"
> >     
> >Message-ID:
> 
> >Content-Type: text/plain;    charset="iso-8859-1"
> >
> >probably the best people for this are implant
> Sciences
=== message truncated ===

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