Generally the reason of stress in Ni electroplating is as follows.
- low temperature(50-60C), improper PH(about 4.5), organic material,
second brilliant material(not using and post-polishing), high current
density and so on.
If thicker plating is needed, I think the control of thickness
uniformity is also important(because of shape dependent stress).
Thickness uniformity is improved when you use auxiliary electrodes.
If you used seed layer, the adhesion of the thin film is also important.


 Sooje Cho

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