You will likely have poor adhesion if you deposit gold directly on SiO2.
You should use a thin layer of either Cr or Ti. Since you have an e-beam
system, use Ti. Ti is easily evaporated by e-beam. 50-100 Angs should be
enough of either metal to give good adhesion.
Good Luck.
************************************
Philip D. Floyd, Ph.D.
Iridigm Display Corporation
2415 Third Street, Suite 235
San Francisco, CA 94107
ph: (415) 626-8800 x138
fax: (415) 626-9775
email: [email protected]
web: http://www.iridigm.com/
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-----Original Message-----
From: Ah Gong [mailto:[email protected]]
Sent: Sunday, September 07, 2003 6:27 PM
To: [email protected]
Subject: [mems-talk] deposition of gold using e-beam
will the contact be good if depositing gold onto a
silicon dioxide or should add some adhesion 4 better contact????
=====
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