Hello everyone ,

          I am trying to find some suitable etchant for W and Cu .It should etch
Cu and W but not BST(Barium strontium titanate) .Can anybody share his/ her
experience in this regard.

Also I am trying to do some lift off  of 0.2 micron thick Cu(using negative PR)
on BST/Alumina substrate. This process works well for BST/Si but not for
BST/Alumina.( my alumina substrate is much rougher than Si wafer) how important
does the surface roughness play a role in lift off process?
Any answers / leads will be very much appreciated.
       Thanks
                 Dipankar Ghosh

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