Transene Company offers etchants for W and Cu which will not attack BST.
Unfortunately, separate etchants will be required for the two metals.
Please visit our website www.transene.com or contact me directly for
more information.

Christopher Christuk
Transene Company
Tel:  978 777 7860
Email:  [email protected]

-----Original Message-----
From: Dipankar Ghosh [mailto:[email protected]]
Sent: Tuesday, September 09, 2003 2:46 PM
To: [email protected]
Subject: [mems-talk] W /Cu etchant and Cu lift off

Hello everyone ,

          I am trying to find some suitable etchant for W and Cu .It
should etch Cu and W but not BST(Barium strontium titanate) .Can anybody
share his/ her experience in this regard.

Also I am trying to do some lift off  of 0.2 micron thick Cu(using
negative PR) on BST/Alumina substrate. This process works well for
BST/Si but not for BST/Alumina.( my alumina substrate is much rougher
than Si wafer) how important does the surface roughness play a role in
lift off process?
Any answers / leads will be very much appreciated.
       Thanks
                 Dipankar Ghosh

OFFICE ADDRESS :-

MATERIALS RESEARCH CENTER,
ROOM 322 , RB-1,
1001 CAPABILITY DRIVE,
CENTENNIAL CAMPUS, NCSU,
RALEIGH ,
NC 27695-7919
USA

PH- 919 515 5049
FAX- 919 515 3419










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