An SF6 plasma will etch both Ti and TiN.
If you already have a recipe that gives a relatively vertical etch profile,
you can increase the pressure (to reduce the mean-free path)
and lower the power (to reduce the ion energy),
both of which result in less directionality in the etch.
--Kirt Williams, Ph.D. consultant
----- Original Message -----
From: laurent gangloff
To:
Sent: Thursday, September 11, 2003 5:48 AM
Subject: [mems-talk] RIE titanium etch
> Hi all,
>
> Does anyone know a RIE recipe to etch titanium, or titanium nitride
(sputter
> deposition) isotropically?
>
> Thanks for your advices.
>
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