Hi Richard,

Use BCB part No. 4024 for adhesive bonding. I use this material for sensor
wafer bonding applications.
Gautham V
for ABSARA MICRO SYSTEMS (S) PTE LTD
17, Philips Street, # 05 - 01
Grand Building, Singapore - 048695

Ph: 65 68580585
Fax: 65 62822870

e-mail: [email protected]
website: www.absaramicro.com
----- Original Message -----
From: "Richard Jiang" 
To: 
Sent: Sunday, September 14, 2003 11:02 PM
Subject: [mems-talk] BCB adhesive wafer bonding


> Hi all,
>
> I am interested in MEMS wafer bonding using dry etch BCB or photo-BCB from
DOW
> Chemicals. Does anyone can tell me which BCB, dry etch BCB or photo-BCB,
is more
> easier to perform adhesive wafer bonding successfully?
>
> I want to bond a MEMS device and a silicon cap (with cavities etched in
it)
> together.
>
> Best regards,
>
> Richard Jiang
>
>
> =====
> Richard Jiang
>
> Shanghai Institute of Microsystem and Information Technology, CAS
> 865 Changning Road
> Shanghai 200050, China
> [email protected]
> Tel: 86-21-62511070-5966
>
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