Hi all,
I use Karl Suss wafer bonder and I have some problems for bonding, using
patterned polymer, two wafers : Si/Glass.
The polymer thickness is about 10 microns and the problem it's all about
the thickness of my 300µm Pyrex wafers (+/- 25µm) (standard product).
So when I apply the pressure on the pyrex wafer I'm not able to bonding
perfectly and with a good uniformity in the whole wafer.
I'd like to know if anybody has the same kind of problem and a possible
solution.
Thanks.


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Dr. Paolo Bondavalli
R&D Engineer
MICROTEC MEMS
THALES (ex THOMSON-CSF) CORPORATE RESEARCH CENTER
Domaine de Corbeville,
Route Departementale 128
F91404 ORSAY
(FRANCE)
Tel : 01 69 33 08 63
Fax : 01 69 33 08 62
Email : [email protected]
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Disclaimer: Opinions expressed herein are my own and may
  not represent those of my employer.
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