Dear MEMS-talk members,

I am currently try to make wafer level Au-Au thermocompression bonding for
4-inch
wafer. Is there anybody having such kind of expeience can tell me
requirement for
the thickness of Au layers in both side and prefered metallization layer
under Au layer?

Thanks in advance,
Wang Qian

_________________________________________________________________
与联机的朋友进行交流，请使用 MSN Messenger:  http://messenger.msn.com/cn