Wang,

Hi.  Please see the paper, "Fabrication of Wafer-Level Thermocompression
Bonds," J. Microelectromachanical Systems, Vol. 11, No 6, December 2002.

Sincerely,

Robert Dean

Auburn University

At 08:44 AM 9/24/03 +0800, you wrote:

>Dear MEMS-talk members,
>
>I am currently try to make wafer level Au-Au thermocompression bonding for
>4-inch
>wafer. Is there anybody having such kind of expeience can tell me
>requirement for
>the thickness of Au layers in both side and prefered metallization layer
>under Au layer?
>
>Thanks in advance,
>Wang Qian
>
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