Hello,
I am looking for a vendor with LPCVD TEOS capability on 6" Si wafers.  I
need to fill 40um deep DRIE trenches that are approximately 10um wide and up
to 1mm in length.  The trench width could be reduced somewhat to accommodate
process constraints if necessary.  The goal is to end up with a void-free
fill.  I would appreciate any leads you could provide.

Thanks for your help,

Randy Bindrup
Newport Opticom Inc.
[email protected]