Hi!
   I had a question about the susceptibility of parylene to the chemicals TMAH
(tetra methyl ammonium hydroxide) & BOE (buffered oxide etch : HF+H2O +NH4F).
Parylene was deposited in hollow silicon molds & needs to be released by etching
away the silicon & some intermediate silicon dioxide. Need to know if the
chemicals would attack the exposed parylene in the process of etching silicon.
Kindly respond.
 - Asma


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