Hello.
-----Ursprüngliche Nachricht-----
Von: Choe,S-H 
An: General MEMS discussion 
Datum: Mittwoch, 8. Oktober 2003 17:46
Betreff: [mems-talk] Etching Method



>http://my.dreamwiz.com/kotai75/picture/Etching.JPG


[rectang. trench with pyramid tip at the bottom]

>The substrate is (100) Silicon wafer and Oxide will be used as a mask.
>
>1. Oxide deposition.
>2. Wet Etching (TMAH)  for pyramid tip (111)
>3. Deep RIE Etching.

I don't think that this process order will give the results you want,
because the Deep RIE process probably will not preserve the shape of your
pyramid. Maybe you should change the order:

1 Oxide
2 Deep RIE
3 TMAH for pyramid

Mayby you need an oxide sidewall protection between 2 and 3.
Regards, Burkhard