HI Rob,

YOu can try dipping it into dilute H2SO4 for ~15sec, then you will see the
shiny surface of copper seed layer. HOpe it helps:>

Linda:)

On Thu, 9 Oct 2003, Rob Davis wrote:

> Date: Thu, 9 Oct 2003 13:29:13 -0400
> From: Rob Davis 
> To: [email protected], [email protected], [email protected]
> Subject: [mems-talk] Copper Electroplate
>
> Greetings all, need advice.  How to minimize flash oxidation of electroplated
copper, are there any tricks or passivation agents?
>
> Thanks
> Rob Davis
> Caldus Semiconductor
> [email protected]
>
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