Dear Sam,

Although we are not situated in the silicon valley area, we do have long time
experience with trough wafer via hole etching of 4" and 6" wafers using the
DRIE-Bosch Process on our Alcatel 601E etchers.

Feel free to contact me directly or visit our homepage for more information on
our MEMS foundry services.

Best regards,
Joern
_______________________________________________________________________________
Jörn Koblitz
Sales and Customer Support
microFAB Bremen GmbH
Universitaetsallee 5
D-28359 Bremen, Germany
phone: +49 421 24 100 24
fax: +49 421 24 100 99
email: [email protected]
web: www.microfab.de
_______________________________________________________________________________



> -----Ursprüngliche Nachricht-----
> Von: Sam Beal [mailto:[email protected]]
> Bereitgestellt: Mittwoch, 1. Oktober 2003 18:45
> Bereitgestellt in: MEMS-talk
> Unterhaltung: [mems-talk] DRIE for through wafer openings
> Betreff: [mems-talk] DRIE for through wafer openings
>
>
> Hi
> I am lookng for DRIE services, preferrably in silicon valley.
>
> I have an integrated circuit application requiring an array
> of large, deep openings.
> Specically I have 6" wafers. I would like to create an array
> of vias 300um (or more) deep. Each via is 400um (or more)
> diameter and a wafer could contain 10,000 or more.
>
> Sam Beal
> JigSawtek
> San Jose, CA
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