hi,
  I am a final yr student of ECE dept of IIT
Kharagpur,INDIA. I am fabricating a MEMS tunnelling
accelerometer. I have to deposit a gold electrode. I
want to know with which it sticks better SiO2 or
Si3N4.
     I got to know from the net that generally before
metallization we deposit a layer of Platinum which
forms platinum silicide and sticks better with gold
and also makes better electrical contact. But is it
better than using Si3N4.
   I would appreciate it if anyone could mail me asap.
For I need to start the metallization process.
  yours sincerely
 Sagar Suthram

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